MobiCom'25

ACM MobiCom 2025 is pleased to partner with the SDP Sensing Challenge (SSC), which will be co-located with MobiCom’25 in Hong Kong. The SSC is a premier international competition dedicated to advancing Integrated Sensing and Communication (ISAC) through cutting-edge Artificial Intelligence (AI) and wireless sensing technologies. As 6G, Wi-Fi, AI-driven algorithms, and passive sensing networks continue to evolve, this challenge provides a global platform for researchers, engineers, and industry professionals to develop and showcase innovative solutions that integrate wireless sensing with AI, including large language models and foundation models. The SSC is organized with leading academic and industrial partners, such as IEEE ISAC-ETI (IEEE Integrated Sensing and Communication Emerging Technology Initiative), China Association of Communications Enterprises, Huawei, Intel, ZTE, Toyota, LG and Chaspark. Participants will gain access to real-world datasets provided by leading companies via the SDP Dataset Platform. All outstanding solutions and models will be open-sourced after the competition to foster global collaboration and ecosystem development in intelligent sensing. Winners of the competition will receive up to 30,000 USD cash prizes. The winning teams will be invited to take part in the MobiCom demo session to showcase their solutions.

The SSC homepage: http://www.sdp8.net/

MobiCom'25 Competition Chair

Organizing Institutions:

Partner

General Chair

Executive Chair