Following the long tradition of poster presentations, ACM MobiCom 2025 solicits submissions for the Poster Program that feature early research work and preliminary results. The MobiCom 2025 Poster Session will provide an excellent opportunity for initial feedback on your early research results and give your ongoing projects early visibility.
We invite submissions on all areas of mobile computing and wireless networking research, including but not limited to:
- Mobile systems for smart spaces (e.g. smart factories, smart workspace, smart agriculture)
- Mobile web, video, virtual reality, and other applications
- Next generation of mobile networks (5G, 6G and beyond)
- Non-terrestrial networks (e.g. UAS, Satellite Networks)
- Novel applications of wireless signals
- Performance evaluation of mobile and wireless networks, protocols, and systems
- Reconfigurable surfaces and meta materials for mobile systems
- Robotic and drone-based networking
- Security and privacy challenges/solutions for mobile/wireless systems
- Sensing with radio, light, sound, and acoustics
- Ubiquitous computing and mobile human computer interaction
- Visible light communications
- Wireless communication and sensing for space/underwater systems
- Wireless localization and tracking
- Applications of machine learning to mobile/wireless research
- Backscatter communication and wireless power
- Mobile edge computing and cloud computing for mobile services
- Decentralized networks and systems
- Embedded and energy-harvesting systems
- Experimental platforms and infrastructures for wireless/mobile research
- Implanted and wearable computing
- Intersection between mobile/wireless research, cloud computing, and software-defined networking
- Long-range/Low-power wide-area wireless networking
- Low-latency networking
- Machine-to-machine communications
- Millimeter wave and terahertz communications
- Mobile data science & analysis
- Mobile health
Poster Submission Instructions
The posters should be submitted via HotCRP: https://mobicom25posters.hotcrp.comThe submission should be formatted as a paper or extended abstract, describing the research to be presented in the poster and should be submitted as a PDF file of at most 3 pages, including all figures and references. Paper text blocks must follow ACM guidelines: double-column US letter size of 8.5 x 11 inches with fonts no smaller than 10 point size. The extended abstract must include the authors' names, affiliations, and email addresses. You may find these templates useful in complying with the above requirements. For Latex users, please use\documentclass[sigconf,10pt]{acmart}. But as an author, you bear the final responsibility to verify (manually or through the above online paper checker) that your submission is format-compliant.
All poster submissions will be reviewed by the Posters committee. Once your poster is accepted, we will include the abstract of your poster on the conference website and publish it in the main proceedings and the ACM digital library. All poster submissions will be considered for the "MobiCom'25 Best Poster Award".
The MOBICOM poster session will also serve as an ACM MOBICOM Student Research Competition (SRC). The ACM SRC offers a unique forum for graduate students (i.e., enrolled in a master or Ph.D. program) and undergraduate students (students enrolled in a program below master level) to present their original research before a panel of judges and attendees.
Student authors are strongly encouraged to include their poster submissions in the ACM MobiCom Student Research Competition.
Important Dates
Deadlines |
Dates |
|
| Submission Deadline | ||
| Acceptance notification | 21 August, 2025 | |
| Camera-ready | 31 August, 2025 |
Organizing Committee
Yasaman Ghasempour, Princeton University, USA
Zhenjiang Li, City University of Hong Kong, China
Technical Program Committee
Fawad Ahmad, Rochester Institute of Technology
Tara Boroushaki, Yale University
Jiani Cao, City University of Hong Kong
Tao Chen, Samsung Research America
Aline Eid, University of Michigan
Nakul Garg, University of Maryland
Ish Kumar Jain, Rensselaer Polytechnic Institute
Sijie Ji, California Institute of Technology
Yang Liu, University of Cambridge/Florida State University (Incoming)
Parth Pathak, George Mason University
Jiliang Wang, Tsinghua University
Yaxiong Xie, University at Buffalo
Chia-Yi Yeh, National Taiwan University