ACM MobiCom 2026 solicits submissions for the Work‑In‑Progress (WiP) Program that feature early research work and preliminary results. The MobiCom 2026 WiP Session will provide an excellent opportunity for initial feedback on your early research results and give your ongoing projects early visibility.

We invite submissions on all areas of mobile computing and wireless networking research, including but not limited to:

• AI and foundation models for communication and networks
• Digital twins for intelligent and autonomous networks
• Integrated Sensing and Communication (ISAC) for Next‑Generation Wireless Systems
• Mobile systems for smart spaces (e.g. smart factories, smart workspace, smart agriculture)
• Mobile web, video, virtual reality, and other applications
• Next generation of mobile networks (5G, 6G and beyond)
• Non-terrestrial networks (e.g. UAS, Satellite Networks)
• Novel applications of wireless signals
• Performance evaluation of mobile and wireless networks, protocols, and systems
• Reconfigurable surfaces and meta materials for mobile systems
• Robotic and drone-based networking
• Security and privacy challenges/solutions for mobile/wireless systems
• Sensing with radio, light, sound, and acoustics
• Ubiquitous computing and mobile human computer interaction
• Visible light communications
• Wireless communication and sensing for space/underwater systems
• Wireless localization and tracking
• Applications of machine learning to mobile/wireless research
• Backscatter communication and wireless power
• Mobile edge computing and cloud computing for mobile services
• Decentralized networks and systems
• Embedded and energy-harvesting systems
• Experimental platforms and infrastructures for wireless/mobile research
• Implanted and wearable computing
• Intersection between mobile/wireless research, cloud computing, and software-defined networking
• Long-range/Low-power wide-area wireless networking
• Low-latency networking
• Machine-to-machine communications
• Millimeter wave and terahertz communications
• Mobile data science & analysis
• Mobile health

WiP Submission Instructions

Submissions should be made via HotCRP: https://mobicom2026posters.hotcrp.com

The submission should be formatted as a paper or extended abstract, describing the research to be presented in the poster and should be submitted as a PDF file of at most 3 pages, including all figures and references. Paper text blocks must follow ACM guidelines: double-column US letter size of 8.5 x 11 inches with fonts no smaller than 10 point size. The extended abstract must include the authors' names, affiliations, and email addresses. You may find these templates useful in complying with the above requirements. For Latex users, please use​\documentclass[sigconf,10pt]{acmart}​. But as an author, you bear the final responsibility to verify (manually or through the above online paper checker) that your submission is format-compliant.

All submissions will be reviewed by the WiP committee. Once your WiP is accepted, we will include the abstract of your WiP on the conference website and publish it in the main proceedings and the ACM digital library. All WiP submissions will be considered for the "MobiCom'26 Best WiP Award". 

Important Dates

Deadlines	Dates
Submission Deadline	June 29, 2026, 23:59 AOE
Acceptance notification	July 31, 2026
Camera-ready	August 10, 2026

Organizing Committee

Sara Garcia Sanchez, IBM Research, USA
Yasaman Ghasempour, Princeton University, USA

Technical Program Committee

Aline Eid, University of Michigan
Amit Trivedi, University of Illinois Chicago
Chia-Yi Yeh, National Taiwan University
Eduardo Baena, Northeastern University
Francesco Linsalata, Politecnico di Milano
Fowad Ahmad, Rochester Institute of Technology
Igor Kadota, Northwestern University
Ish Kumar Jain, Rensselaer Polytechnic Institute
Nakul Garg, Rice University
Pedram Johari, Northeastern University
Salvatore D’oro, Northeastern University
Sun Zehua, National University of Singapore
Tara Boroushaki, Yale University